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About GrithviTech
Adaptive wafer handling for the next generation of semiconductor manufacturing.
GrithviTech Semiconductors is building APSRG — Adjustable & Perceptible Soft Robotic Grippers that help fabs handle warped, ultra-thin, and fragile wafers with greater safety, sensing, and control
Our Story
GrithviTech Semiconductors Private Limited is an India-focused semiconductor equipment startup developing intelligent end-effectors for fragile wafer handling. The company’s core innovation, APSRG, replaces rigid contact with adaptive soft robotics and embedded sensing to reduce breakage, improve grip stability, and support higher manufacturing yields.
We are building for a semiconductor future shaped by thinner wafers, 3D heterogeneous integration, chiplets, backside power delivery, and advanced nodes where conventional rigid handling systems become a growing reliability risk
Problem
As semiconductor manufacturing moves toward sub-2nm nodes and advanced packaging, wafers are becoming thinner and more vulnerable to warpage and mechanical stress. Traditional ceramic or metal end-effectors are designed for flat surfaces, so on bowed wafers they can create point-load stress that leads to micro-fractures or total wafer loss.
Current vacuum-based handling systems also lack tactile awareness, which means they cannot sense poor seating or early slip conditions until failure is already underway. In advanced fabs, a single shattered wafer can trigger not just material loss but also downtime for tool cleaning and decontamination.
Solution
APSRG is GrithviTech’s soft robotic wafer handling system designed to grip delicate substrates more safely and intelligently than conventional rigid end-effectors. It combines soft actuation, embedded sensing, and real-time slip awareness to create a perceptive handling layer for fab automation.
Core capabilities
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Morphological adaptation: Silicone-based soft actuators conform to wafer curvature, including bow or warp up to 10 mm, to distribute pressure more uniformly.
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Embedded liquid metal sensing: Stretchable EGaIn circuitry acts like a nervous system, providing real-time feedback on contact pressure and wafer orientation.
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Incipient slip detection: Integrated TENG sensors detect micro-vibrations around 60 ms before slip, enabling immediate micro-adjustment in grip force
Why It Matters
GrithviTech is not just offering a gripper; it is building a yield-protection layer for semiconductor fabs. APSRG is designed to reduce wafer scrap, lower the risk of crashes, and improve handling resilience in environments where conventional systems struggle with fragile, warped, or thermally stressed substrates.
For Indian fabs, the product also supports a local manufacturing and local equipment strategy by reducing dependence on imported specialty end-effectors.
Why It Matters
GrithviTech is not just offering a gripper; it is building a yield-protection layer for semiconductor fabs. APSRG is designed to reduce wafer scrap, lower the risk of crashes, and improve handling resilience in environments where conventional systems struggle with fragile, warped, or thermally stressed substrates.
For Indian fabs, the product also supports a local manufacturing and local equipment strategy by reducing dependence on imported specialty end-effectors.
